1 Introduction At present, the research level of semiconductor integrated circuits at home and abroad has basically the ability to integrate some complex electromechanical systems on the chip. Almost 100 billion US dollars of industrial infrastructure can be used to support MEMS technology, those that are mass-produced. At the same time, MEMS consisting of electronic and mechanical components with dimensions ranging from nanometers to millimeters has become a new direction for the development of microelectronics integration in the world. Multi-door practical MEMS demonstration samples are interpreted in the early products, and the commercialization of mass-produced micro-accelerometers, force-sensitive sensors, micro-gyros, digital micro-mirrors, optical switches, etc. is maturing, initially forming a market scale of 10 billion US dollars. The annual growth rate is above 30%. When MEMS is blended with other technologies, it will often spawn new MEMS devices, providing a very large market and innovation opportunity for microelectronics technology, and it is likely to trigger an industrial revolution in the next few decades. However, there are still many challenges in realizing the commercialization and marketization of MEMS. There are still many industrialized technical problems that require in-depth research and resolution. In particular, the development of MEMS packaging technology is relatively lagging behind, and packaging barriers are formed in some aspects. The research and development of many MEMS devices is still in the laboratory stage for the time being. Firstly, solving this bottleneck to the market and promoting the speeding up of the industrial chain has become a consensus. 2 MEMS package features MEMS technology is a typical multi-disciplinary cross-infiltration, comprehensive and fashionable front-end research and development field, involving almost all natural and engineering disciplines, with monocrystalline silicon Si, SiO 2 , SiN, SOI and other materials as the main materials. The mechanical properties of Si are excellent. Its strength, hardness and Young's modulus are comparable to those of Fe. The density is similar to A1, and the thermal conductivity is comparable to that of Mo and W. In the manufacture of complex device structures, various mature surface micro-bD techniques and bulk micromachining technologies are currently used, and LIGA (ie, deep x-ray etching, micro-electroforming, plastic molding, etc.) The German abbreviation of the link) technology, micro-powder casting, instant mask EFAB represents the expansion of three-dimensional processing. Thus MEMS packages have their own special characteristics that are significantly different from IC chip packages: (1) Specificity MEMS typically have moving parts or suspended structures, silicon cup cavities, beams, trenches, grooves, diaphragms, and even fluid and organic components that operate essentially by surface effects. The package architecture depends on the MEMS device and its application. For MEMS devices of various structures and applications, the package design must be adapted to local conditions, coordinated with the manufacturing technology, and highly specialized. (2) complexity Depending on the application, most MEMS package housings need to have a non-electrical signal path directly connected to the outside world, for example, an input that transmits one or more kinds of information such as light, magnetism, heat, force, and chemistry. The input signal interface is complex, and special requirements are placed on chip passivation and package protection. Some MEMS packages and their technologies are newer than MEMS, which is not only technically difficult, but also requires 100 levels of cleanliness in the packaging environment. (3) Spatiality In order to provide sufficient movable and movable space for the movable part of the MEMS, it is necessary to etch or leave a certain groove shape and other shape space on the outer casing. The potted MEMS requires a clearance on the surface, and a package can provide a Very effective protection of the cavity. (4) Protective MEMS fabricated on wafers are always sensitive to environmental influences before they are packaged. The various processing steps, dicing, sintering, interconnection, sealing, etc. of the MEMS package require special treatment methods, provide corresponding protection measures, and install a grid frame to prevent mechanical damage to the movable parts. The circuit part of the system must also be isolated from the environment to avoid affecting the performance of the processing circuit, requiring the package and its materials to not adversely affect the environment. (5) Reliability MEMS is used in a wide range of applications, and requires higher reliability requirements for its packaging. In particular, it is required to ensure that the product is safely operated under harsh conditions and protected from harmful environmental pollution. The hermetic package can dissipate excess heat. (6) Economics MEMS packaging mainly adopts customized research and development, and is now in the initial stage of development. It is far from serialization and standardization. Its packaging accounts for 40%-90% of the total product price, and reducing packaging costs is a hot topic. In summary, the biggest difference between IC packaging and MEMS packaging is that MEMS generally have to be in contact with the outside world, while ICs are just the opposite. The main function of the package is to protect the chip and complete the electrical interconnection. It is not possible to directly transplant the IC package to more complicated ones. MEMS. But in a broad sense, MEMS packaging is based on a standardized IC chip package architecture. Most of the current technologies follow the mature microelectronic packaging process, and are improved and evolved to meet the requirements of MEMS special signal interface, housing, cavity, reliability, and cost reduction. 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